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Was (wer) ist etching powder - definition
![An anisotropic wet etch on a silicon wafer creates a cavity with a trapezoidal cross-section. The bottom of the cavity is a {100} plane (see [[Miller indices]]), and the sides are {111} planes. The blue material is an etch mask, and the green material is silicon.](https://commons.wikimedia.org/wiki/Special:FilePath/Anisotropic wet etching.svg?width=200 "An anisotropic wet etch on a silicon wafer creates a cavity with a trapezoidal cross-section. The bottom of the cavity is a {100} plane (see [[Miller indices]]), and the sides are {111} planes. The blue material is an etch mask, and the green material is silicon.")
![Relief etching by William Blake, frontispiece to ''[[America a Prophecy]]'' (Copy A, printed 1795)](https://commons.wikimedia.org/wiki/Special:FilePath/America a Prophecy copy a plate 01.jpg?width=200 "Relief etching by William Blake, frontispiece to ''[[America a Prophecy]]'' (Copy A, printed 1795)")
![Selection of early etched printing plates from the [[British Museum]]](https://commons.wikimedia.org/wiki/Special:FilePath/BM engraved printing plates.jpg?width=200 "Selection of early etched printing plates from the [[British Museum]]")
![Photograph of the necklace in question]]</ref>](https://commons.wikimedia.org/wiki/Special:FilePath/British Museum Middle East 14022019 Gold and carnelian beads 2600-2300 BC Royal cemetery of Ur (composite).jpg?width=200 "Photograph of the necklace in question]]</ref>")
![Etching by [[Jacques Bellange]], ''Gardener with basket'' c. 1612](https://commons.wikimedia.org/wiki/Special:FilePath/Gardener with a Basket on her Arm, from Hortulanae series MET MM10514.jpg?width=200 "Etching by [[Jacques Bellange]], ''Gardener with basket'' c. 1612")
Wikipedia
Isotropic etching is a method commonly used in semiconductors to remove material from a substrate via a chemical process using an etchant substance. The etchant may be in liquid-, gas- or plasma-phase, although liquid etchants such as buffered hydrofluoric acid (BHF) for silicon dioxide etching are more often used. Unlike anisotropic etching, isotropic etching does not etch in a single direction, but rather etches in multiple directions within the substrate. Any horizontal component of the etch direction may therefore result in undercutting of patterned areas, and significant changes to device characteristics. Isotropic etching may occur unavoidably, or it may be desirable for process reasons.
